3D IC
3D IC (Three-Dimensional Integrated Circuit) is an advanced semiconductor packaging technology that stacks multiple integrated circuit dies vertically using through-silicon vias (TSVs) to create a single, high-performance device. It enables heterogeneous integration of different technologies (e.g., logic, memory, sensors) in a compact form factor, reducing interconnect lengths and improving power efficiency, bandwidth, and performance compared to traditional 2D planar designs. This approach addresses the limitations of Moore's Law scaling by moving beyond single-die architectures.
Developers should learn about 3D IC when working on high-performance computing, AI accelerators, mobile devices, or IoT systems where space, power, and speed are critical constraints. It is essential for designing next-generation chips that require dense integration of diverse components, such as combining processors with high-bandwidth memory in data centers or creating compact sensors for wearables. Understanding 3D IC helps in optimizing system architecture, thermal management, and signal integrity in advanced hardware projects.