Multi Chip Module
A Multi Chip Module (MCM) is an electronic assembly that integrates multiple semiconductor dies or chips onto a single substrate or package, enabling high-density interconnections and improved performance. It allows for heterogeneous integration of different technologies, such as processors, memory, and sensors, in a compact form factor. MCMs are used to enhance system performance, reduce power consumption, and minimize physical footprint compared to traditional discrete chip assemblies.
Developers should learn about MCMs when working on high-performance computing, embedded systems, or IoT devices where space, power efficiency, and speed are critical, such as in data centers, aerospace, or mobile applications. It is essential for hardware engineers and system architects designing advanced electronics to optimize integration and overcome limitations of single-chip solutions. Understanding MCMs helps in leveraging technologies like 2.5D/3D packaging for better thermal management and signal integrity.